part number: XZM2CRKM2DG55W-8 3.2x1.6mm smd chip led lamp aug 03,2016 xdsb8747 v1-x layout: maggie l. p. 1/4 features ideal for indication light on hand held products long life and robust package standard package: 2,000pcs/ reel msl (moisture sensitivity level): 3 rohs compliant attention observe precautions for handling electrostatic discharge sensitive devices package schematics notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.2(0.008") unless otherwise noted. 3. specifications are subjec t to change without notice. red (algainp) green (ingan) unit forward voltage (typ.) (i f =20ma) v f 2.2 3.2 v forward voltage (max.) (i f =20ma) v f 2.8 4 v reverse current (max.) (v r =5v) i r 10 50 ua wavelength of peak emission cie127-2007* (typ.) (i f =20ma) p 640* 520* nm wavelength of dominant emission cie127-2007* (typ.) (i f =20ma) d 625* 525* nm spectral line full width at half-maximum (typ.) (i f =20ma) 20 35 nm capacitance (typ.) (v f =0v, f=1mhz) c 27 100 pf operating characteristics (t a =25c) part number emitting color emitting material lens-color wavelength cie127-2007* nm p viewing angle 2 1/2 min. typ. XZM2CRKM2DG55W-8 red algainp water clear 3000 700* 4190 1295* 640* 30 green ingan 700 700* 1295 1295* 520* luminous intensity cie127-2007* (i f =20ma) mcd red green absolute maximum ratings (t a =25c) red (algainp) green (ingan) unit reverse voltage v r 5 5 v forward current i f 30 30 ma forward current (peak) 1/10 duty cycle 0.1ms pulse width i fs 150 100 ma power dissipation p d 84 120 mw 3000 450 v operating temperature t a -40 ~ +85 c storage temperature tstg -40 ~ +85 electrostatic discharge threshold (hbm) a relative humidity between 40% and 60% is recommended in esd-protected work areas to reduce static build up during assembly process (reference jedec/jesd625-a and jedec/j-std-033)
part number: XZM2CRKM2DG55W-8 3.2x1.6mm smd chip led lamp aug 03,2016 xdsb8747 v1-x layout: maggie l. p. 2/4 ? red ? green
part number: XZM2CRKM2DG55W-8 3.2x1.6mm smd chip led lamp aug 03,2016 xdsb8747 v1-x layout: maggie l. p. 3/4 led is recommended for reflow soldering and soldering profile is shown below. ? the device has a single mounting surface. the device must be mounted according to the specifications. ? recommended soldering pattern (units : mm; tolerance: 0.1) ? tape specification (units : mm) ? reel dimension remarks: if special sorting is required (e.g. binn ing based on forward voltage, luminous intensity / luminous flux, or wavelength), the typical accuracy of the so rting process is as follows: 1. wavelength: +/-1nm 2. luminous intensity / luminous flux: +/-15% 3. forward voltage: +/-0.1v note: accuracy may depend on the sorting parameters.
part number: XZM2CRKM2DG55W-8 3.2x1.6mm smd chip led lamp aug 03,2016 xdsb8747 v1-x layout: maggie l. p. 4/4 packing & label specifications terms of use 1. data presented in this document reflect statistical figures and should be treated as technical reference only. 2. contents within this document are subject to improvement and enhancement changes without notice. 3. the product(s) in this document are designed to be operated within the electrical and environmental specifications indicated on the datasheet. user accepts full risk and responsibility when operating the product(s) beyond their intended specifications. 4. the product(s) described in this document are intended for electronic applications in which a person?s life is not reliant u pon the led. please consult with a sunled representative for special applications where the led may have a direct impact on a person?s life. 5. the contents within this document may not be altered without prior consent by sunled. 6. additional technical notes are available at http://www.sunledusa.co m/technicalnotes.asp ? xzxxx55xx
|
